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FeaturePak Data Acquisition Module with 2MHz A/D, D/A, autocalibration, and digital I/O

FeaturePak-DAQ1616

Buy Diamond Systems\' FeaturePak-DAQ1616 Other Peripheral Modules

Advantages

  • Compact, low profile form-factor-0.6x the size of a credit card!
  • Single low-cost connector integrates all host and external I/O signals
  • Provides up to 100 I/O points per module
  • Leverages industry-standard buses such as PCI Express, USB, and SMBus
  • Host form-factor and processor agnostic
  • Coexists with PC/104, SUMIT, Qseven, ETX, XTX, COM Express, etc.
  • Multiple FeaturePak modules may be present within one system
  • Rugged and reliable
  • Open industry standard
Request a quote for the FeaturePak-DAQ1616

FeaturePak-DAQ1616 is a data acquisition I/O card integrating Diamond's newest and fastest analog I/O technology and a PCI Express host interface.

This tiny board offers 16-bit A/D sampling at 2MHz, supported with an expanded 16K-sample FIFO for reliable data collection in any operating system. Analog output capability has been expanded to 16 16-bit channels with programmable output ranges. All analog I/O features are enhanced with our industry-leading autocalibration technology, featuring independent calibration factors for each input and output range to guarantee maximum accuracy across all operating modes and the entire operating temperature range.

Digital I/O features include seven 8-bit ports with both bit-wide and byte-wide direction control, two 32-bit up/down counter/timers with programmable input source and gate, four 24-bit pulse-width modulation circuits with 0-100% duty cycle, and a watchdog timer. The board is available in analog I/O and analog out-only configurations.


About the FeaturePak embedded I/O standard

The FeaturePak™ Initiative, originated by Diamond Systems, was launched at the Embedded World tradeshow in March, 2010. The FeaturePak Specification defines a highly-compact, low-profile, and inexpensive way to add configurable I/O functions to embedded systems. The tiny FeaturePak modules -- measuring just 1.70 x 2.55 inches -- can be used for providing snap-in options or upgrades for off-the-shelf single board computers (SBCs) and computer-on-module (COM) baseboards, or as building blocks to simplify the development of fully-custom embedded electronics.

Additionally, FeaturePak modules provide "zero height expansion," in that they fit within the normal component envelope of an SBC or COM baseboard and add no height to PC/104-style I/O expansion stacks.

FileDescription
featurepakdaq1616_spec.pdf FeaturePak-DAQ1616 Spec Sheet
featurepakdaq1616_man.pdf FeaturePak-DAQ1616 Manual
Part NumberDescriptionStatus
FP-DAQ1616 FeaturePak Analog I/O Module, extended temp
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