Power and Computing Solutions for Harsh Environments
AMD Geode LX Series Processor COM unit
ETX-700
Advantages
- AMD Geode LX Series Processors
- AMD CS5536 (Southbridge)
- Non-ECC DDR 333/400 Memory
- CRT/ LVDS LCD/ TTL LCD
- 10/100Base-TX Ethernet
- AC97 Audio CODEC
- One CompactFlash Type I Slot
- Two SATA 150 Connectors
- +5V Operating Voltage
- Meets ETX 3.0 Standard
AAEON announced the new Embedded Technology eXtended (ETX) product - ETX-700, which is based on the AMD LX processor combined with AMD CS5536 chipset.
ETX-700 can provide common PC peripheral functions such as graphics, USB, serial, parallel ports, keyboard/mouse, Ethernet, and IDE. The baseboard designer can optimize exactly which and how these functions are implemented physically.
All of AAEON's ETX modules have a standard form factor and a standard connector layout that carry a specified set of signals. By adopting this standardization, the designers can create a single system of carrier board that can accept present and future ETX modules in terms of their needs. In another word, AAEON will have different ETX solutions so that customers can upgrade the module without having to change their carrier board.
The ETX-700 was designed specially to improve the quality and speed of your product development. AAEON ETX series represent features of scalability, reliability and qualified services. It provides more compact size and more flexibility for your various applications as well.
| File | Description | |
| tfetx700_spec.pdf | ETX-700 Spec Sheet | |
| tfetx700_man.pdf | ETX-700 Manual |
| Part Number | Description | Status |
| TF-ETX-700-B10 | ETX Board.AMD LX800.TTL.DDR.LAN.Audio.2COM.USB2.0.CF.Rev.B1.0 | |
| TF-ETX-700-B10-01 | ETX Board.AMD LX800.18-bit LVDS.DDR.LAN.Audio.2COM.USB2.0.CF.Rev.B1.0 | |
| TF-ETX-700-B10-02 | ETX Board.AMD LX800.24-bit LVDS.DDR.LAN.Audio.2COM.USB2.0.CF.Rev.B1.0 |
| Accessories and Options | ||
| DDRII SODIMM 667 | n/a | |
| TF-ECB-902M-A10 | ETX Carrier Board.LAN,Audio.COM,USB2.0.PCI.ISA.AT/ATX.Rev A1.0 | |
| TF-PER-A036 | Passive Heat-sink.For ETX-700.On-board CPU.Full Size | |
| TF-PER-A047 | Passive Heat-sink.For XTX-915/945.On-board CPU | |
| TF-PER-A049 | Heat Spreader Kit.For XTX-915/945.On-board CPU | |
| TF-PER-A050 | Heat Spreader Kit.For ETX-700.On-board CPU | |
| TF-PER-A068 | Passive Heat-sink.For ETX-CX700M.On-board CPU | |
| TF-PER-A069 | Active Cooler.For ETX-CX700M.On-board CPU | |
| UP-DR14D6A01G26 | (TF)1G.DDR333 SO-DIMM.200Pin.Samsung K4H510838."X"-"X"CCC.Transcend.TS128MSD64V3A | |
| UP-DR14D6A51245 | 512MB.SODIMM.DDR-400.200Pin.Non-ECC Memory.Transcend.TS64MSD64V4J | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |
