The COM-690T / COM-690E support AMD's Turion / Sempron (S1 Socket) processors with AMD's M690T + SB600 chipset. The COM-690T offers two 200-pin DDRII SODIMM slots enabling dual channel operation with non-ECC DDRII 667/800 and up to 4GB total capacity. A key feature of the COM-690T / COM-690E is the superior graphic performance which is enhanced by AMD's side-port dedicated display cache. The VGA/LCD/TV (TV, COM-690T only) controller is integrated in AMD M690T/E, which supports CRT/LCD, CRT/DVI, LCD/DVI, LCD/TV, TV/DVI simultaneous/ dual view displays. The display controller shares system memory up to 1024MB and the LCD interface is up to 24-bit dual-channel LVDS.
COM-690T / COM-690E accommodate flexible expansion interfaces--one PCI-Express(x8)shared with HDMI/DVI), three PCI-Express(x1), four 32-bit PCI, one LPC bus, one SMBus, and one I2C interface. The versatile expansion interfaces allow system manufactures to expand their embedded systems without having to worry about purchasing other devices to build up necessary functions.
In addition to the features above, the COM-690T incorporates Gigabit Ethernet for a faster network connection and transmission. The COM-690T is an ideal platform to upgrade existing designs and increase product functionality. AAEON not only provides the high performance COM Express Module-COM-690T, but also offers COM Express carrier board design services to meet your specific project requirements.
| File | Description | |
| tfcom690_spec.pdf | COM-690 Spec Sheet | |
| tfcom690_man.pdf | COM-690 Manual |
| Part Number | Description | Status |
| TF-COM-690E-A10 | COM Express.S1 Socket.M690E.Dual DDRII.GbE.USB 2.0.Rev.A1.0 | |
| TF-COM-690E-A10-01 | COM Express.S1 Socket.M690E.SP (128MB).Dual DDRII.GbE.USB 2.0.TPM.Rev.A1.0 |
| Accessories and Options | ||
| 9697V03B06-D | (TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 | |
| 9697V07B01-D | (TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 | |
| 1702021832 | (TF)Power Cord.2P.2P.183cm.USA | |
| 1706301500 | (TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm | |
| DDRII SODIMM 667 | n/a | |
| TF-ECB-916M-A10 | COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-01 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-02 | COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 | |
| TF-ECB-916M-A21 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 | |
| TF-ECB-951D-A10 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 | |
| TF-ECB-951D-A10-01 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 | |
| TF-PER-A051 | CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan | |
| TF-PER-A052 | CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan | |
| TF-PER-A053 | CPU Cooler.For COM-690T.Socket-type CPU.12V Fan | |
| TF-PER-A055 | Passive Heat-sink.For COM-945GSE.On-board CPU | |
| TF-PER-A056 | Heat Spreader Kit.For COM-945GSE.On-board CPU | |
| TF-PER-A057 | Heat Spreader Kit.For COM-U15.On-board CPU | |
| TF-PER-A060 | CPU Cooler.For COM-945GSE.On-board CPU.12V Fan | |
| TF-PER-A062 | Passive Heat-sink.For COM-U15.On-board CPU | |
| TF-PER-A066 | Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | |
| TF-PER-A072 | Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A073 | CPU Cooler.For COM-45GS.On-board CPU.12V Fan | |
| TF-PER-A074 | Passive Heat-sink.For COM-45GS.On-board CPU | |
| TF-PER-A075 | Heat Spreader Kit.For COM-45GS.On-board CPU | |
| TF-PER-A076 | Passive Heat-sink.For COM-945.Socket-type CPU | |
| TF-PER-A077 | Passive Heat-sink.For COM-945.On-board CPU | |
| TF-PER-A078 | CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan | |
| TF-PER-A079 | CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan | |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A083 | CPU Cooler.For COM-LN.On-board CPU.12V Fan | |
| TF-PER-A084 | Passive Heat-sink.For COM-LN.On-board CPU | |
| TF-PER-A085 | Heat Spreader Kit.For COM-LN.On-board CPU | |
| TF-PER-A086 | Heat Spreader Kit.For COM-945.Socket-type CPU | |
| TF-PER-A087 | Heat Spreader Kit.For COM-945.On-board CPU | |
| TF-PER-A093 | Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A094 | Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A104 | CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan | |
| TF-PER-A105 | Passive Heatsink.For NanoCOM-LN.On board CPU | |
| TF-PER-A106 | Heat Spreader Kit.For NanoCOM-LN.On Board CPU | |
| UP-DR14D6A01G42 | (TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U | |
| UP-DR14D6A40960 | (TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N | |
| UP-DR14D6B01G2F | (TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G2F | (TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U | |
| UP-DR14D6B02G2R | (TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |