AAEON announced the new Embedded Technology eXtended (ETX) product -- ETX-CX700M, which is based on the VIA C7/ Eden (V4) series processors combined with VIA CX700M chipset.
ETX-CX700M provides common PC peripheral functions such as graphics, USB, serial, parallel port, keyboard/mouse, Ethernet, SATA and IDE. The baseboard designer can optimize exactly which and how these functions are implemented physically.
All of AAEON's ETX modules have a standard form factor and a standard connector layout that carry a specified set of signals. By adopting this standardization, the designers can create a single system of carrier board that can accept present and future ETX modules in terms of their needs. In another word, AAEON will have different ETX solutions so that customers can upgrade the module without having to change their carrier board. The ETX-CX700M was designed specially to improve the quality and speed of your product development. AAEON ETX series represent features of scalability, reliability and qualified services. It provides more compact size and more flexibility for your various applications as well
| Part Number | Description | Status |
| TF-ETX-CX700M-A10 |
ETX Board.Eden 1.6GHz.DDRII.LAN.Audio.2COM.USB2.0.Rev 1.0 |
|
| TF-ETX-CX700M-A10-01 |
ETX Board.VIA C7 2.0GHz.DDRII.LAN.Audio 2COM.USB2.0.Rev 1.0 |
|
| TF-ETX-CX700M-A10-02 |
ETX Board.VIA Eden 1.0GHz.DDRII.LAN.Audio 2COM.USB2.0.Rev 1.0 |
|
| TF-ETX-CX700M-A10-03 |
ETX Board.VIA C7 1.5GHz.DDRII.LAN.Audio 2COM.USB2.0.Rev 1.0 |
|
| Accessories and Options |
| TF-ECB-902M-A10 |
ETX Carrier Board.LAN,Audio.COM,USB2.0.PCI.ISA.AT/ATX.Rev A1.0 |
|
| TF-PER-A036 |
Passive Heat-sink.For ETX-700.On-board CPU.Full Size |
|
| TF-PER-A047 |
Passive Heat-sink.For XTX-915/945.On-board CPU |
|
| TF-PER-A049 |
Heat Spreader Kit.For XTX-915/945.On-board CPU |
|
| TF-PER-A050 |
Heat Spreader Kit.For ETX-700.On-board CPU |
|
| TF-PER-A068 |
Passive Heat-sink.For ETX-CX700M.On-board CPU |
|
| TF-PER-A069 |
Active Cooler.For ETX-CX700M.On-board CPU |
|
| UP-DR14D6A01G26 |
(TF)1G.DDR333 SO-DIMM.200Pin.Samsung K4H510838."X"-"X"CCC.Transcend.TS128MSD64V3A |
|
| UP-DR14D6A51245 |
512MB.SODIMM.DDR-400.200Pin.Non-ECC Memory.Transcend.TS64MSD64V4J |
|
| UP-DR14D6B01G22 |
(TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J |
|
| UP-DR14D6B02G23 |
(TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG |
|
| UP-DR14D6B51225 |
512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M |
|
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