Power and Computing Solutions for Harsh Environments
COM Express CPU Module with Onboard Intel Atom Z530/Z510 Processor
COM-U15
Advantages
- Onboard Intel Atom Z530/Z510 Processor
- Intel System Controller Hub US15W
- DDRII 400/533 Memory, Max. 2GB
- Gigabit Ethernet
- Up to 24-bit LVDS LCD, SDVO
- High Defi nition Audio Interface
- PATA SSD (Up to 4GB) x 1, SATA II x 1 or PATA x 1
- USB2.0 x 8
- PCI-Express [x1] x 1
- Wide DC Input Range, +8.5V to +19V
- COM Express Pin-out Type II
- Compact Module Size, 95mm x 95mm
To accommodate fast growing marketing segments, AAEON has developed a brand new COM Express CPU module. The COM-U15, and its accompanying carrier board-ECB-951D, adopts Intel Atom Z530/Z510 processor and Intel System Controller Hub US15W chipset, offering high speed PCI-Express bus interface and serial ATA for your high performance applications requiring high-speed and greater stability. The COM Express CPU module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-U15 supports up to 24-bit single channel LVDS interface and supports one 200-pin DDRII 400/533 SODIMM memory module up to 2GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, one onboard PATA SSD (Master device) and one PATA/ one SATAII interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.
| File | Description | |
| comu15_spec.pdf | COM-U15 Spec Sheet | |
| comu15_man.pdf | COM-U15 Manual |
| Part Number | Description | Status |
| TF-COM-U15-A20 | COM Express.Z510 (1.1GHz).US15W.DDRII SO-DIMM.GbE.SATA.USB2.0.Rev.A2.0 | |
| TF-COM-U15-A20-01 | COM Express.Z530 (1.6GHz).US15W.DDRII SO-DIMM.GbE.SATA.USB2.0.Rev.A2.0 | |
| TF-COM-U15-A20-02 | COM Express.Z530 (1.6GHz).US15W.DDRII SO-DIMM.GbE.SATA.4GB SSD.USB2.0.Rev.A2.0 |
| Accessories and Options | ||
| 9697V03B06-D | (TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 | |
| 9697V07B01-D | (TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 | |
| 1702021832 | (TF)Power Cord.2P.2P.183cm.USA | |
| 1706301500 | (TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm | |
| DDRII SODIMM 667 | n/a | |
| TF-ECB-916M-A10 | COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-01 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-02 | COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 | |
| TF-ECB-916M-A21 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 | |
| TF-ECB-951D-A10 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 | |
| TF-ECB-951D-A10-01 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 | |
| TF-PER-A051 | CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan | |
| TF-PER-A052 | CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan | |
| TF-PER-A053 | CPU Cooler.For COM-690T.Socket-type CPU.12V Fan | |
| TF-PER-A055 | Passive Heat-sink.For COM-945GSE.On-board CPU | |
| TF-PER-A056 | Heat Spreader Kit.For COM-945GSE.On-board CPU | |
| TF-PER-A057 | Heat Spreader Kit.For COM-U15.On-board CPU | |
| TF-PER-A060 | CPU Cooler.For COM-945GSE.On-board CPU.12V Fan | |
| TF-PER-A062 | Passive Heat-sink.For COM-U15.On-board CPU | |
| TF-PER-A066 | Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | |
| TF-PER-A072 | Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A073 | CPU Cooler.For COM-45GS.On-board CPU.12V Fan | |
| TF-PER-A074 | Passive Heat-sink.For COM-45GS.On-board CPU | |
| TF-PER-A075 | Heat Spreader Kit.For COM-45GS.On-board CPU | |
| TF-PER-A076 | Passive Heat-sink.For COM-945.Socket-type CPU | |
| TF-PER-A077 | Passive Heat-sink.For COM-945.On-board CPU | |
| TF-PER-A078 | CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan | |
| TF-PER-A079 | CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan | |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A083 | CPU Cooler.For COM-LN.On-board CPU.12V Fan | |
| TF-PER-A084 | Passive Heat-sink.For COM-LN.On-board CPU | |
| TF-PER-A085 | Heat Spreader Kit.For COM-LN.On-board CPU | |
| TF-PER-A086 | Heat Spreader Kit.For COM-945.Socket-type CPU | |
| TF-PER-A087 | Heat Spreader Kit.For COM-945.On-board CPU | |
| TF-PER-A093 | Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A094 | Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A104 | CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan | |
| TF-PER-A105 | Passive Heatsink.For NanoCOM-LN.On board CPU | |
| TF-PER-A106 | Heat Spreader Kit.For NanoCOM-LN.On Board CPU | |
| UP-DR14D6A01G42 | (TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U | |
| UP-DR14D6A40960 | (TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N | |
| UP-DR14D6B01G2F | (TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G2F | (TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U | |
| UP-DR14D6B02G2R | (TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |
