Power and Computing Solutions for Harsh Environments
COM Express CPU Module With Onboard Intel® Atom™ N450/ D410/ D510 Processor
COM-LN
Advantages
- Onboard Intel Atom N450/ D410/ D510 Processor
- Intel ICH8M
- SODIMM DDR2 533/667/800 Memory, Max. 4 GB
- Gigabit Ethernet
- CRT, 18-bit Single-channel LVDS LCD
- High Definition Audio Interface
- PATA x 1, SATA II x 3
- USB2.0 x 8
- PCI x 4/ PCI-Express[x1] x 5 (x 6: Optional)
- Wide DC Input Range, +8.5V To +19V (Optional)
- COM Express Pin-out Type II
- Compact Module Size, 95mm x 95mm
AAEON announces a brand new COM Express CPU module that adopts the Intel® AtomTM processor D510, the first dual-core CPU in the Intel Atom processor family supported for embedded applications. With the increasing demand for smaller, lower-power, yet higher-performance embedded solutions, the COM-LN brings the state-of-the-art technology of the Intel® AtomTM processor to the embedded world.
The Intel® AtomTM processor D510 supports Intel® Hyper-Threading Technology and features an integrated graphics controller (GMA 3150) along with a built-in memory controller reducing the chipset footprint. COM-LN utilizes the Intel® 82801HM I/O Controller (ICH8M) to create a feature-rich platform and the Intel® 82567V Gigabit Ethernet Controller for Gigabit Ethernet connection. One parallel IDE and three SATA II interfaces allow flexible storage options. Five PCI-Express[x1] lanes, optional six PCI-Express[x1] lanes, four 32-bit PCI, as well as LPC, SMBus and I2C provide versatile expansion interfaces. This multitude of expansion interfaces allows system integrators to easily expand their embedded systems.
| File | Description | |
| comln_spec.pdf | COM-LN Spec Sheet | |
| comln_man.pdf | COM-LN Manual |
| Part Number | Description | Status |
| TF-COM-LN-A10 | COM Express.N450.Dual DDRII.GbE.SATA.USB2.0.Rev.A1.0 | |
| TF-COM-LN-A10-01 | COM Express.D510.Dual DDRII.GbE.SATA.USB2.0.Rev.A1.0 | |
| TF-COM-LN-A10-02 | COM Express.D410.Dual DDRII.GbE.SATA.USB2.0.Rev.A1.0 |
| Accessories and Options | ||
| 9697V03B06-D | (TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 | |
| 9697V07B01-D | (TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 | |
| 1702021832 | (TF)Power Cord.2P.2P.183cm.USA | |
| 1706301500 | (TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm | |
| DDRII SODIMM 667 | n/a | |
| TF-ECB-916M-A10 | COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-01 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-02 | COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 | |
| TF-ECB-916M-A21 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 | |
| TF-ECB-951D-A10 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 | |
| TF-ECB-951D-A10-01 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 | |
| TF-PER-A051 | CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan | |
| TF-PER-A052 | CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan | |
| TF-PER-A053 | CPU Cooler.For COM-690T.Socket-type CPU.12V Fan | |
| TF-PER-A055 | Passive Heat-sink.For COM-945GSE.On-board CPU | |
| TF-PER-A056 | Heat Spreader Kit.For COM-945GSE.On-board CPU | |
| TF-PER-A057 | Heat Spreader Kit.For COM-U15.On-board CPU | |
| TF-PER-A060 | CPU Cooler.For COM-945GSE.On-board CPU.12V Fan | |
| TF-PER-A062 | Passive Heat-sink.For COM-U15.On-board CPU | |
| TF-PER-A066 | Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | |
| TF-PER-A072 | Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A073 | CPU Cooler.For COM-45GS.On-board CPU.12V Fan | |
| TF-PER-A074 | Passive Heat-sink.For COM-45GS.On-board CPU | |
| TF-PER-A075 | Heat Spreader Kit.For COM-45GS.On-board CPU | |
| TF-PER-A076 | Passive Heat-sink.For COM-945.Socket-type CPU | |
| TF-PER-A077 | Passive Heat-sink.For COM-945.On-board CPU | |
| TF-PER-A078 | CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan | |
| TF-PER-A079 | CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan | |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A083 | CPU Cooler.For COM-LN.On-board CPU.12V Fan | |
| TF-PER-A084 | Passive Heat-sink.For COM-LN.On-board CPU | |
| TF-PER-A085 | Heat Spreader Kit.For COM-LN.On-board CPU | |
| TF-PER-A086 | Heat Spreader Kit.For COM-945.Socket-type CPU | |
| TF-PER-A087 | Heat Spreader Kit.For COM-945.On-board CPU | |
| TF-PER-A093 | Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A094 | Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A104 | CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan | |
| TF-PER-A105 | Passive Heatsink.For NanoCOM-LN.On board CPU | |
| TF-PER-A106 | Heat Spreader Kit.For NanoCOM-LN.On Board CPU | |
| UP-DR14D6A01G42 | (TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U | |
| UP-DR14D6A40960 | (TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N | |
| UP-DR14D6B01G2F | (TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G2F | (TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U | |
| UP-DR14D6B02G2R | (TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |
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