Power and Computing Solutions for Harsh Environments
Intel Core 2 Duo/ Core Duo/ Core Solo/ Celeron M (Yonah) Processors
COM-945
Advantages
- COM Express Basic Module, Pin-out Type II
- Intel Core 2 Duo/ Core Duo/ Core Solo/ CeleronM (Yonah) Processors
- Intel 945GM + ICH7-M Chipset
- Non-ECC DDRII 400/533/667 Memory
- CRT/ LVDS/ TV
- Gigabit Ethernet
- AC97 Digital Audio Interface
- +12V Operation Voltage
To accommodate fast growing marketing segments, AAEON has developed a brand new COM (Computer-on-module) Express CPU Module. The COM-945GSE, and its accompanying carrier board-ECB-916M, adopts Intel Atom N270 processor and Intel's 945GSE chipset, offering high speed PCI-Express bus interface and serial ATA for your high performance applications requiring high-speed and greater stability. The COM Express CPU Module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-945GSE supports 18-bit dual-channel LVDS interface and supports one DDRII 400/533 SODIMM memory module up to 2GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, one PATA and two SATA interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.
| File | Description | |
| com945_spec.pdf | COM-945 Spec Sheet | |
| com945_man.pdf | COM-945 Manual |
| Part Number | Description | Status |
| TF-COM-945-A20 | COM Express.Socket 478.945GME.DDRII.GbE.USB 2.0.Rev.A2.0 |
| Accessories and Options | ||
| 9697V03B06-D | (TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 | |
| 9697V07B01-D | (TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 | |
| 1702021832 | (TF)Power Cord.2P.2P.183cm.USA | |
| 1706301500 | (TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm | |
| DDRII SODIMM 667 | n/a | |
| TF-ECB-916M-A10 | COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-01 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-02 | COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 | |
| TF-ECB-916M-A21 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 | |
| TF-ECB-951D-A10 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 | |
| TF-ECB-951D-A10-01 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 | |
| TF-PER-A051 | CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan | |
| TF-PER-A052 | CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan | |
| TF-PER-A053 | CPU Cooler.For COM-690T.Socket-type CPU.12V Fan | |
| TF-PER-A055 | Passive Heat-sink.For COM-945GSE.On-board CPU | |
| TF-PER-A056 | Heat Spreader Kit.For COM-945GSE.On-board CPU | |
| TF-PER-A057 | Heat Spreader Kit.For COM-U15.On-board CPU | |
| TF-PER-A060 | CPU Cooler.For COM-945GSE.On-board CPU.12V Fan | |
| TF-PER-A062 | Passive Heat-sink.For COM-U15.On-board CPU | |
| TF-PER-A066 | Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | |
| TF-PER-A072 | Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A073 | CPU Cooler.For COM-45GS.On-board CPU.12V Fan | |
| TF-PER-A074 | Passive Heat-sink.For COM-45GS.On-board CPU | |
| TF-PER-A075 | Heat Spreader Kit.For COM-45GS.On-board CPU | |
| TF-PER-A076 | Passive Heat-sink.For COM-945.Socket-type CPU | |
| TF-PER-A077 | Passive Heat-sink.For COM-945.On-board CPU | |
| TF-PER-A078 | CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan | |
| TF-PER-A079 | CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan | |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A083 | CPU Cooler.For COM-LN.On-board CPU.12V Fan | |
| TF-PER-A084 | Passive Heat-sink.For COM-LN.On-board CPU | |
| TF-PER-A085 | Heat Spreader Kit.For COM-LN.On-board CPU | |
| TF-PER-A086 | Heat Spreader Kit.For COM-945.Socket-type CPU | |
| TF-PER-A087 | Heat Spreader Kit.For COM-945.On-board CPU | |
| TF-PER-A093 | Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A094 | Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A104 | CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan | |
| TF-PER-A105 | Passive Heatsink.For NanoCOM-LN.On board CPU | |
| TF-PER-A106 | Heat Spreader Kit.For NanoCOM-LN.On Board CPU | |
| UP-DR14D6A01G42 | (TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U | |
| UP-DR14D6A40960 | (TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N | |
| UP-DR14D6B01G2F | (TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G2F | (TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U | |
| UP-DR14D6B02G2R | (TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |
