Power and Computing Solutions for Harsh Environments
COM Express CPU Module with Intel Core 2 Duo/ Celeron M (Socket-P Based) Processors
COM-45SP
Advantages
- Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processors
- Intel® GM45 + ICH9M
- Dual-channel DDRIII 800/1066 Memory, Max. 8GB
- Gigabit Ethernet
- CRT, Up to 24-bit Dual-channel LVDS LCD, TV, Display Port, HDMI, DVI
- High Definition Audio Interface
- SATA II x 4
- USB2.0 x 8
- PCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5
- Wide DC Input Range, +8.5V to +19V
- COM Express Basic Module Pin-out Type II
To accommodate fast growing marketing segments, AAEON has developed a brand new COM (Computer-on-module) Express CPU Module. The COM-45SP, and its accompanying carrier board-ECB-916M, adopts Intel Core 2 Duo/ Celeron M (socket-P based) processor and Intel's GM45+ICH9M chipset, offering high speed PCI-Express(x16) and PCI-Express(x1) bus interfaces for your high performance applications requiring high-speed and greater stability. The COM Express CPU Module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-45SP supports 24-bit dual-channel LVDS LCD interface and supports two DDRIII 800/1066 SODIMM memory module up to 8GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, four SATA II interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.
| File | Description | |
| com45sp_spec.pdf | COM-45SP Spec Sheet | |
| com45sp_man.pdf | COM-45SP Manual |
| Part Number | Description | Status |
| TF-COM-45SP-A10 | COM Express.Socket P.Dual DDRIII.GbE.USB 2.0.Rev.A1.0 |
| Accessories and Options | ||
| 9697V03B06-D | (TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 | |
| 9697V07B01-D | (TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 | |
| 1702021832 | (TF)Power Cord.2P.2P.183cm.USA | |
| 1706301500 | (TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm | |
| DDRII SODIMM 667 | n/a | |
| TF-ECB-916M-A10 | COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-01 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 | |
| TF-ECB-916M-A10-02 | COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 | |
| TF-ECB-916M-A21 | COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 | |
| TF-ECB-951D-A10 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 | |
| TF-ECB-951D-A10-01 | COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 | |
| TF-PER-A051 | CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan | |
| TF-PER-A052 | CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan | |
| TF-PER-A053 | CPU Cooler.For COM-690T.Socket-type CPU.12V Fan | |
| TF-PER-A055 | Passive Heat-sink.For COM-945GSE.On-board CPU | |
| TF-PER-A056 | Heat Spreader Kit.For COM-945GSE.On-board CPU | |
| TF-PER-A057 | Heat Spreader Kit.For COM-U15.On-board CPU | |
| TF-PER-A060 | CPU Cooler.For COM-945GSE.On-board CPU.12V Fan | |
| TF-PER-A062 | Passive Heat-sink.For COM-U15.On-board CPU | |
| TF-PER-A066 | Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | |
| TF-PER-A072 | Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A073 | CPU Cooler.For COM-45GS.On-board CPU.12V Fan | |
| TF-PER-A074 | Passive Heat-sink.For COM-45GS.On-board CPU | |
| TF-PER-A075 | Heat Spreader Kit.For COM-45GS.On-board CPU | |
| TF-PER-A076 | Passive Heat-sink.For COM-945.Socket-type CPU | |
| TF-PER-A077 | Passive Heat-sink.For COM-945.On-board CPU | |
| TF-PER-A078 | CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan | |
| TF-PER-A079 | CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan | |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | |
| TF-PER-A083 | CPU Cooler.For COM-LN.On-board CPU.12V Fan | |
| TF-PER-A084 | Passive Heat-sink.For COM-LN.On-board CPU | |
| TF-PER-A085 | Heat Spreader Kit.For COM-LN.On-board CPU | |
| TF-PER-A086 | Heat Spreader Kit.For COM-945.Socket-type CPU | |
| TF-PER-A087 | Heat Spreader Kit.For COM-945.On-board CPU | |
| TF-PER-A093 | Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A094 | Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU | |
| TF-PER-A104 | CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan | |
| TF-PER-A105 | Passive Heatsink.For NanoCOM-LN.On board CPU | |
| TF-PER-A106 | Heat Spreader Kit.For NanoCOM-LN.On Board CPU | |
| UP-DR14D6A01G42 | (TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U | |
| UP-DR14D6A40960 | (TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N | |
| UP-DR14D6B01G2F | (TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B01G22 | (TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J | |
| UP-DR14D6B02G2F | (TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U | |
| UP-DR14D6B02G2R | (TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp | |
| UP-DR14D6B02G23 | (TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG | |
| UP-DR14D6B51225 | 512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M | |
