The COM-45GS supports onboard Intel® Core™ 2 Duo/ Celeron® M (SFF, 22x22mm) processors and can be ordered with the Intel® SL9400 (1.8GHz @ 17W), the Intel® SU9300 (1.2GHz @ 10W) or the Intel® Celeron® 723 (1.2GHz @ 10W). The module offers 2 SODIMM slots for support of up to 8GB DDR3 in a dual channel configuration. A Gigabit Ethernet provides high bandwidth network connectivity. Also included are eight USB2.0 ports, a PATA interface to support one device, three SATA II channels, high definition audio and 4 bits programmable GPIO. Also available at the module interface are four 32-bit PCI ports, one LPC bus, one SMBus, one I2C interface, five PCIExpressx1 ports as well as x16 PCIExpress for graphics.
The mobile Intel Graphics Media Accelerator 4500MHD with Intel Clear Video Technology allows the COM-45GS to provide high definition video playback and improved 3D rendering. All popular display output options are available, such as HDMI, DisplayPort, LVDS, DVI and analog RGB. The multiplexed x16 PCI interface allows the designer to choose from a variety of simultaneous and sual display configurations. Hardware accelerated MPEG2 decode along with WMV9 (VC-1), H.264 (AVC), and Microsoft DirectX 10 make the COM-45GS an ideal platform for media intense applications. Operating with a wide DC power input (8.5V to 19V) the COM-45GS is a "go anywhere" platform. Ideal but not limited to applications in Digital Signage, Gaming & Entertainment, Healthcare, Test & Measurement, industrial Automation, Security, Defense & Government.
| Part Number | Description | Status |
| TF-COM-45GS-A10 |
COM Express.SL9400.Dual DDRIII.GbE.USB 2.0.Rev.A1.0 |
|
| TF-COM-45GS-A10-01 |
COM Express.SU9300.Dual DDRIII.GbE.USB 2.0.Rev.A1.0 |
|
| TF-COM-45GS-A10-02 |
COM Express.C-M 723.Dual DDRIII.GbE.USB 2.0.Rev.A1.0 |
|
| TF-COM-45GSW1-A10 |
COM Express.SL9400.Dual DDRIII.GbE.USB 2.0.Rev.A1.0.WiTAS I |
|
| TF-COM-45GSW1-A10-01 |
COM Express.SU9300.Dual DDRIII.GbE.USB 2.0.Rev.A1.0.WiTAS I |
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| Accessories and Options |
| 9697V03B06-D |
(TF)ASS'Y.PER-V03B.Rev.A1.0.SDVO TO DVI.FOR nano COM-U15 |
|
| 9697V07B01-D |
(TF)ASS'Y.PER-V07B.Rev.A0.1.SDVO TO VGA.for NanoCOM-U15 |
|
| 1702021832 |
(TF)Power Cord.2P.2P.183cm.USA |
|
| 1706301500 |
(TF)FFC Cable.B TYPE.30P 0.5 Pitch.L=150mm |
|
| DDRII SODIMM 667 |
n/a |
|
| TF-ECB-916M-A10 |
COM Exp. Carrier Board.mATX.10/100 Base-TX+GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 |
|
| TF-ECB-916M-A10-01 |
COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.Rev.A1.0 |
|
| TF-ECB-916M-A10-02 |
COM Exp.Carrier Board.mATX.Dual GbE.7.1CH Audio.4COM.USB.PCI-E.AT/ATX.6th SO.Rev.A1.0 |
|
| TF-ECB-916M-A21 |
COM Exp. Carrier Board.mATX.Dual GbE.7.1CH Audio.2COM (Winbond).USB.PCI-E.AT/ATX.Rev.A2.1 |
|
| TF-ECB-951D-A10 |
COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.2 Connectors.Rev.A1 |
|
| TF-ECB-951D-A10-01 |
COM Express Carrier Board.GbE.2CH Audio.2COM.USB2.0.CF.SD.PCI-E.DC.1 Connector.Rev.A1.0 |
|
| TF-PER-A051 |
CPU Cooler.FOR COM-965/COM-45SP.Socket-type CPU.12V Fan |
|
| TF-PER-A052 |
CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan |
|
| TF-PER-A053 |
CPU Cooler.For COM-690T.Socket-type CPU.12V Fan |
|
| TF-PER-A055 |
Passive Heat-sink.For COM-945GSE.On-board CPU |
|
| TF-PER-A056 |
Heat Spreader Kit.For COM-945GSE.On-board CPU |
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| TF-PER-A057 |
Heat Spreader Kit.For COM-U15.On-board CPU |
|
| TF-PER-A060 |
CPU Cooler.For COM-945GSE.On-board CPU.12V Fan |
|
| TF-PER-A062 |
Passive Heat-sink.For COM-U15.On-board CPU |
|
| TF-PER-A066 |
Heat Spreader Kit.For COM-965/COM-45SP.On-board CPU. |
|
| TF-PER-A067 |
Passive Heat-sink.For COM-965/COM-45SP.On-board CPU |
|
| TF-PER-A072 |
Heat Spreader Kit.For COM-965/COM-45SP.Socket-type CPU |
|
| TF-PER-A073 |
CPU Cooler.For COM-45GS.On-board CPU.12V Fan |
|
| TF-PER-A074 |
Passive Heat-sink.For COM-45GS.On-board CPU |
|
| TF-PER-A075 |
Heat Spreader Kit.For COM-45GS.On-board CPU |
|
| TF-PER-A076 |
Passive Heat-sink.For COM-945.Socket-type CPU |
|
| TF-PER-A077 |
Passive Heat-sink.For COM-945.On-board CPU |
|
| TF-PER-A078 |
CPU Cooler.For COM-945.Socket-type CPU.High TDP.12V Fan |
|
| TF-PER-A079 |
CPU Cooler.For COM-945.On-board CPU.High TDP.12V Fan |
|
| TF-PER-A082 |
Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU |
|
| TF-PER-A083 |
CPU Cooler.For COM-LN.On-board CPU.12V Fan |
|
| TF-PER-A084 |
Passive Heat-sink.For COM-LN.On-board CPU |
|
| TF-PER-A085 |
Heat Spreader Kit.For COM-LN.On-board CPU |
|
| TF-PER-A086 |
Heat Spreader Kit.For COM-945.Socket-type CPU |
|
| TF-PER-A087 |
Heat Spreader Kit.For COM-945.On-board CPU |
|
| TF-PER-A093 |
Passive Heat-sink.For NanoCOM-U15 A2.0.On-board CPU |
|
| TF-PER-A094 |
Heat Spreader Kit.For NanoCOM-U15 A2.0.On-board CPU |
|
| TF-PER-A104 |
CPU Cooler.For NanoCOM-LN.On board CPU.12V Fan |
|
| TF-PER-A105 |
Passive Heatsink.For NanoCOM-LN.On board CPU |
|
| TF-PER-A106 |
Heat Spreader Kit.For NanoCOM-LN.On Board CPU |
|
| UP-DR14D6A01G42 |
(TF)1G.DDR3 Memory 204Pin SO-DIMM.Transcend.TS128MSK64V1U |
|
| UP-DR14D6A40960 |
(TF)204PIN DDR3 1066 SO-DIMM 4096MB With 256Mx8 CL7.Transcend.TS512MSK64V1N |
|
| UP-DR14D6B01G2F |
(TF)1GB.200PIN DDR2 800 SO-DIMM.Transcend.TS128MSQ64V8U-I. Wide Temp |
|
| UP-DR14D6B01G22 |
(TF)1GB.DDRII.SODIMM 200PIN.Transcend .TS128MSQ64V6J |
|
| UP-DR14D6B02G2F |
(TF)2GB.DDR3 Memory 204Pin SODIMM.1066.Transcend.TS256MSK64V1U |
|
| UP-DR14D6B02G2R |
(TF)2GB.200PIN DDR2 800 SO-DIMM.Transcend.TS256MSQ64V8U-I. Wide Temp |
|
| UP-DR14D6B02G23 |
(TF)2GB.DDR II.667 SODIMM.200 pin.TRANSCEND.TS256MSQ64V6U-SAMSUNG |
|
| UP-DR14D6B51225 |
512M.DDR2-667.200PIN.32Mx16 SO-DIMM Unbuffer Non-ECC.Transcend.TS64MSQ64V6M |
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